Fujipoly SARCON® Thermal Interface Materials & Gap Fillers
High-performance thermal solutions for today’s high-power electronic designs
As electronic systems become smaller, faster and more powerful, effectively transferring heat from critical components has become one of the most important challenges facing design engineers.
Fujipoly SARCON® thermal interface materials provide a broad range of solutions for transferring heat between electronic components and heat sinks, cold plates, chassis and other cooling surfaces.
Training Videos
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Fujipoly Customer Engineering Resource Center
FUJIPOLY CUSTOMER ENGINEERING RESOURCE CENTER Thermal Engineering Support in Silicon Valley Fujipoly’s Customer Engineering Resource Center (CERC) in San Jose, California…
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Fujipoly Product Comparison
Fujipoly SARCON® PG & GR Thermal Materials Compare Fujipoly SARCON® thermal gap fillers by thermal conductivity, material type, available thickness and…
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Fujipoly PG150A
FUJIPOLY SARCON® THERMAL INTERFACE MATERIAL SARCON® PG150A 15 W/m·K Ultra-Soft Thermal Putty Gap Filler Fujipoly SARCON® PG150A is an ultra-high-performance, extremely…
Fujipoly Electronic & Thermal Management Solutions
Fujipoly develops high-performance thermal interface materials, elastomeric connectors, silicone rubber components and specialized electronic packaging materials for automotive, aerospace, telecommunications, industrial, medical and consumer electronics.
SARCON® Thermal Interface Materials
High-performance thermal interface materials designed to fill microscopic air gaps and larger mechanical gaps between electronic components and heatsinks, cold plates, chassis surfaces or other thermal-management hardware.
Product Technologies:- Soft thermal gap pads
- Ultra-soft putty sheets
- Gel-type thermal interface materials
- Thin-film thermal materials
- Dispensable thermal compounds
- Thermally conductive greases
- High thermal conductivity
- Low thermal resistance
- Excellent surface conformity
- Low compression-force options
- Electrically insulating options
- Wide range of thicknesses and material properties
Typical Applications:
CPUs, GPUs, AI accelerators, optical transceivers, power modules,
battery systems, telecom equipment, automotive electronics,
servers and industrial electronics.
High-Performance SARCON® Gap Fillers
Fujipoly’s advanced soft gel and ultra-soft putty technologies provide high thermal conductivity while minimizing mechanical stress on sensitive electronic components.
Featured Products:- GR45A — 4.5 W/m·K
- PG45A — 4.5 W/m·K
- PG80B — 8 W/m·K
- GR130A — 13 W/m·K
- PG130A — 13 W/m·K
- PG150A — 15 W/m·K
- Very low compression force
- Excellent conformity to uneven surfaces
- High thermal conductivity
- Thin-gap capability
- Easy assembly and rework
Best For:
High-performance computing, AI hardware, telecom systems,
optical modules and power electronics requiring strong thermal
performance with electrical insulation.
Carbon Fiber Gap Fillers
Ultra-high-performance thermal gap fillers use vertically oriented carbon fibers to deliver exceptionally high through-plane thermal conductivity.
Featured Products:- CF210A — 21 W/m·K
- CF400A — 40 W/m·K
- Extremely high thermal conductivity
- Soft, conformable gap-filling construction
- Excellent performance in high-power electronics
- High through-plane heat-transfer capability
- Designed for demanding thermal loads
Important:
Carbon-fiber gap fillers are electrically conductive and should
only be used where electrical conductivity can be accommodated.
Typical Applications:
AI accelerators, high-power processors, telecom equipment,
power converters and other high-heat-flux systems.
Dispensable Thermal Interface Materials
Paste-like thermal compounds fill irregular and very small gaps while requiring extremely low assembly pressure.
Featured Products:- SPG-20B
- SPG-30B
- SPG-50A
- SPG-70A — 7 W/m·K
- Automated dispensing compatible
- Conforms to complex geometries
- Very low compression force
- Excellent filling of small gaps
- Suitable for high-volume manufacturing
Typical Applications:
Automated electronics assembly, CPUs, power devices, LEDs,
telecom products and complex PCB assemblies.
Thermally Conductive Greases
SARCON® thermal greases provide low thermal resistance in thin bond-line applications where maximum surface wetting is required.
Product Families:- SG-07SL
- SG-26SL
- SG-07NS
- SG-26NS
- SG-42NS
- Silicone-based greases
- Non-silicone greases
- Low-bleed formulations
- High-temperature-capable materials
Typical Applications:
Processors, semiconductors, power modules, heatsinks,
cold plates and thin thermal interfaces.
Thin-Film Silicone Thermal Materials
Thin thermally conductive silicone rubber materials provide thermal transfer, electrical isolation and mechanical protection in a durable film format.
Available Configurations:- Tubes
- Tapes
- Cases
- Die-cut gaskets
- Adhesive-backed options
- Electrical insulation
- Thermal conductivity
- UL94 V-0 options
- Mechanical reinforcement
- Custom die-cut capability
Typical Applications:
Transistors, power semiconductors, electrical isolation,
protective covers and thermal mounting applications.
ZEBRA® Elastomeric Connectors
Solderless elastomeric connectors use alternating conductive and insulating silicone layers to create dense, reliable electrical connections between displays, PCBs and electronic assemblies.
Key Benefits:- High-density I/O capability
- Low electrical resistance
- Low insertion and compression force
- Redundant contact engagement
- No soldering required
- Excellent mechanical reliability
- Plain type
- Solid self-support type
- Insulation barrier type
- Sponge self-support type
- Carbon and silver conductor options
Typical Applications:
LCDs, displays, medical electronics, instrumentation,
test equipment and compact electronic assemblies.
Custom Silicone Rubber Extrusions
Custom silicone rubber profiles provide sealing, cushioning, insulating and mechanical protection for electronic and industrial assemblies.
Capabilities:- Custom profile geometries
- Silicone rubber materials
- Electronic packaging applications
- Sealing and gasketing profiles
- Custom dimensions and formulations
Typical Applications:
Electronics enclosures, displays, automotive electronics,
industrial equipment, sealing and mechanical protection.
Fusible Silicone Tapes
Specialized silicone tapes provide insulation, protection and sealing for electrical and electronic assemblies.
Typical Benefits:- Electrical insulation
- Flexible wrapping
- Conformability
- Environmental protection
- Suitable for irregular geometries
Typical Applications:
Cable assemblies, electrical connections, insulation,
industrial electronics and protective wrapping.
Featured Fujipoly Technologies
PG150A — 15 W/m·K
Ultra-soft, high-conductivity SARCON® putty designed for high-performance, low-compression-force thermal interfaces.
Best For: AI processors, telecom systems, power electronics and thin-gap applications requiring electrical insulation.
CF400A — 40 W/m·K
Carbon-fiber gap filler offering extremely high through-plane thermal conductivity for demanding high-power applications.
Best For: Maximum-performance cooling where electrical conductivity is acceptable.
SPG-70A — 7 W/m·K
High-performance dispensable SARCON® thermal material that conforms easily to complex component geometries and delicate gaps.
Best For: Automated dispensing, form-in-place thermal interfaces and low-pressure gap filling.
ZEBRA® Elastomeric Connectors
Solderless elastomeric interconnect technology provides dense, reliable electrical connections with low assembly force.
Best For: LCDs, displays, medical electronics, instrumentation and compact electronic interfaces.
Thin-Film SARCON® Materials
Thin silicone rubber materials combine thermal transfer, electrical insulation and mechanical protection for semiconductor mounting and isolation.
Best For: Transistors, power semiconductors, electrical isolation and thin thermal interfaces.
Fujipoly Technical Data Library
Access Fujipoly technical data sheets for SARCON® gap fillers, putty materials, form-in-place compounds, thin films, carbon-fiber products and ZEBRA® connectors.
Includes: GR, PG, SPG, CF and ZEBRA® technical data sheets plus catalogs and engineering information.
Which Fujipoly Technology Is Right for Your Application?
Start with SARCON® GR or PG Series .
Consider the SARCON® PG Series, including PG150A.
Consider SPG Series dispensable thermal materials.
Consider Carbon Fiber Gap Fillers .
Consider Thermally Conductive Greases or thin-film SARCON® materials.
Consider Thin-Film Silicone Thermal Materials .
Consider Custom Silicone Rubber Extrusions.
Fujipoly Application Markets
Processors, GPUs, accelerators, memory and server thermal management.
Optical transceivers, base stations, servers and communications equipment.
Battery packs, inverters, ECUs, lighting and power electronics.
Avionics, power electronics, aircraft and spacecraft thermal systems.
Factory automation, robotics, power conditioners and industrial controls.
Displays, gaming systems, cameras, appliances and compact electronic products.
Fujipoly Product Resources
View All Fujipoly Products SARCON® Thermal Materials ZEBRA® Connectors Engineering Resources Request a SampleNeed Help Selecting a SARCON Gap Filler?
Westech Associates represents Fujipoly thermal-management solutions for OEM and engineering customers in Northern California and Nevada.
Our team can help evaluate your thermal application, including component power, available gap, heat-sink or cold-plate configuration, compression requirements and manufacturing considerations.
For particularly demanding thermal applications, ask us about SARCON PG150A 15 W/m-K extremely compressible gap filler, as well as Fujipoly’s CF210A 21 W/m-K and CF400A 40 W/m-K carbon-fiber thermal gap fillers.
Contact Westech Associates to discuss your application, request technical information or obtain Fujipoly SARCON samples for engineering evaluation.
Thermal performance depends on material thickness, compression, contact area, mating surfaces and application conditions. Engineers should consult the applicable Fujipoly Technical Data Sheet and validate the selected SARCON material under actual application conditions before production use.