SARCON® PG150A
15 W/m·K Ultra-Soft Thermal Putty Gap Filler
Fujipoly SARCON® PG150A is an ultra-high-performance, extremely compressible thermal interface material engineered for applications requiring excellent heat transfer with low mechanical stress on sensitive components.
PG150A at a Glance
What Is SARCON® PG150A?
PG150A is part of Fujipoly’s SARCON® extremely compressible putty-type gap filler family. The material combines very high thermal conductivity with a highly conformable silicone compound that readily fills small air gaps and irregular mating surfaces.
Its soft putty-like consistency allows the material to conform closely around electronic components while minimizing the compression force transferred to the PCB or device.
PG150A is particularly useful when conventional thermal pads are too firm or when grease creates manufacturing, handling or rework challenges.
Key Features
- 15 W/m·K thermal conductivity
- Extremely compressible putty construction
- Very low compression force
- Excellent conformity to uneven surfaces
- Tacky on both sides
- Thin bond-line capability
- Electrically insulating
- Non-flammable / V-0 equivalent
- Wide operating temperature range
- Custom die-cut configurations available
Available PG150A Thicknesses
PG150A is available in multiple standard thicknesses, allowing engineers to select the appropriate amount of material for the available thermal gap and required compression.
Standard sheet size is 300 mm × 200 mm, with a recommended usable area of approximately 290 mm × 190 mm. Custom converted and die-cut configurations may also be available.
Why Use PG150A?
High Thermal Performance
At 15 W/m·K, PG150A provides significantly higher thermal conductivity than conventional general-purpose gap pads.
Low Component Stress
The highly compressible putty construction allows the material to deform around components without requiring the high assembly forces associated with firmer thermal pads.
Excellent Surface Contact
PG150A conforms to microscopic surface irregularities and component-height variations, helping eliminate insulating air pockets at the thermal interface.
Clean Assembly
The pre-formed sheet construction provides controlled material placement and can be easier to manufacture and rework than conventional thermal grease.
Thin Gap Capability
Standard material beginning at only 0.3 mm makes PG150A especially useful for high-performance designs with relatively narrow component-to-heatsink gaps.
Electrical Isolation
Unlike electrically conductive carbon-fiber gap fillers, PG150A can provide high thermal performance while maintaining electrical isolation.
Typical PG150A Applications
GPUs, AI accelerators, processors, memory and server hardware.
Optical modules, transceivers, networking and base-station electronics.
Power modules, converters, regulators and high-power semiconductor assemblies.
ECUs, ADAS electronics, displays, power conversion and EV systems.
Controllers, robotics, automation equipment and power supplies.
Applications where component-height variation requires a highly conformable thermal interface.
Designed to Fill the Real Thermal Gap
Even apparently smooth component and heatsink surfaces contain microscopic irregularities. Air trapped between those surfaces significantly increases thermal resistance.
PG150A compresses and conforms around those irregularities, replacing insulating air with a highly thermally conductive interface material.
Fujipoly recommends controlling the material volume and compression uniformly across the interface rather than applying excessive localized pressure.
Where PG150A Fits in the SARCON® Putty Family
| Product | Thermal Conductivity | Starting Thickness | Positioning |
|---|---|---|---|
| PG45A | 4.5 W/m·K | 1.5 mm | Very low modulus / low compression force |
| PG65A | 6.5 W/m·K | 0.5 mm | Mid-performance putty |
| PG80B | 8.0 W/m·K | 0.5 mm | High-performance soft putty |
| PG130A | 13 W/m·K | 0.3 mm | Very high thermal performance |
| PG150A | 15 W/m·K | 0.3 mm | Highest-performance PG putty |
Useful Temperature Range
Equivalent to approximately −40°F to +302°F.
Material Construction
Gray silicone compound with tacky surfaces on both sides. PG150A is designed as an extremely compressible putty-type thermal gap filler.
PG150A Technical Resources
Review Fujipoly’s official technical data before specifying PG150A for a production design.