Wakefield Thermal Solutions
Wakefield Thermal offers a comprehensive range of thermal management technologies for cooling electronic systems, from board-level heatsinks and extrusions to liquid cold plates, heat pipes, air movers and thermal interface materials.
Thermal Extrusions
Aluminum extruded heatsinks provide a versatile and economical solution for natural and forced-convection cooling.
Product Highlights:- Standard aluminum heatsink profiles
- Natural and forced convection cooling
- Cut-to-length configurations
- Machining and finishing options
- Anodized and chromate finishes
Typical Applications:
Power supplies, industrial controls, communications equipment,
power electronics and OEM electronic systems.
Board-Level Heatsinks
Compact air-cooled heatsinks designed for cooling individual semiconductors and other PCB-mounted heat-generating components.
Product Highlights:- TO-220 heatsinks
- TO-247 / TO-264 heatsinks
- Pin-fin heatsinks
- Clip-mounted designs
- omniKlip™ heatsinks
Typical Applications:
MOSFETs, IGBTs, power transistors, voltage regulators, rectifiers
and power semiconductors.
BGA Heatsinks
Low-profile heatsinks designed to attach directly to BGA, FPGA, ASIC and other surface-mounted devices.
Product Highlights:- Extruded BGA heatsinks
- Low-profile cooling
- Push-pin attachment
- Adhesive attachment options
- Natural and forced-air cooling
Typical Applications:
FPGAs, ASICs, processors, networking equipment and embedded computing.
LED Heatsinks
Thermal solutions for removing heat from high-power LED devices and lighting assemblies.
Typical Applications:- Commercial LED lighting
- Industrial lighting
- Architectural lighting
- High-power LED modules
- Specialty illumination systems
High Power Skived Fin Heatsinks
Complete high-performance cooling assemblies combining dense skived fins with fans and mounting hardware for demanding heat loads.
Key Benefits:- High fin density
- Turnkey fan/heatsink assemblies
- High forced-air cooling performance
- Designed for high-power devices
Typical Applications:
Servers, telecom systems, power electronics, industrial equipment
and high-performance computing.
Skived Fin Heatsinks
Skived-fin technology creates thin, densely spaced fins directly from an aluminum or copper base for increased cooling surface area.
Key Benefits:- Higher fin density than many extrusions
- Aluminum and copper options
- Excellent heat spreading
- Low thermal resistance
Typical Applications:
AI hardware, telecom equipment, servers, power conversion and
high-heat-flux electronics.
Bonded Fin Heatsinks
Bonded-fin heatsinks use individual fins bonded into a grooved base to create high-density cooling structures for high-power applications.
Key Benefits:- High fin density
- Large heatsink sizes
- Flexible fin spacing
- Suitable for natural or forced convection
Typical Applications:
Inverters, motor drives, power systems, telecommunications,
UPS systems and industrial electronics.
DC/DC Converter Heatsinks
Purpose-built heatsinks for industry-standard DC/DC power converter footprints.
Available Formats:- Quarter-Brick
- Half-Brick
- Full-Brick
Typical Applications:
Telecom power, networking, industrial power conversion and
distributed power architectures.
Fans & Air Movers
Fans and blowers provide forced airflow for heatsinks, chassis and complete electronic systems.
Product Highlights:- DC axial fans
- DC blowers
- Slimline blowers
- High-performance server fans
- CPU cooling solutions
Typical Applications:
Servers, telecom systems, industrial electronics, power supplies
and equipment enclosures.
Liquid Cold Plates
Liquid cold plates provide high-performance cooling when thermal or space requirements can no longer be economically met using air cooling.
Product Highlights:- Machined-channel cold plates
- Rolled-tube cold plates
- Buried-tube constructions
- Exposed-tube configurations
- Standard and engineered designs
Typical Applications:
Power electronics, IGBT modules, EV systems, semiconductor equipment,
lasers, data centers and high-performance computing.
Heat Pipes
Two-phase heat-transfer devices that efficiently transport heat from a concentrated heat source to a remote heatsink or heat exchanger.
Product Highlights:- Sintered wick heat pipes
- Round configurations
- Flattened configurations
- Multiple diameters and lengths
- Custom bending and forming
Typical Applications:
Embedded computing, telecom, medical electronics, power electronics
and compact equipment.
Vapor Chambers
Vapor chambers spread heat from concentrated heat sources over a larger surface area using evaporation and condensation.
Typical Applications:- Processors and GPUs
- High-power semiconductors
- Compact electronics
- Heat-spreading applications
- High heat-flux devices
Thermal Interface Materials
Thermal interface materials fill microscopic air gaps between electronic devices and heatsinks to improve heat transfer.
Product Highlights:- Gap pads
- Phase-change materials
- OmniPad™ insulators
- Thermal pads
- Thermal attachment materials
Typical Applications:
Power modules, semiconductor packages, heatsink assemblies
and electrically isolated thermal interfaces.
Which Wakefield Thermal Technology Is Right for Your Application?
Wakefield Thermal Product Resources
All Thermal Solutions Air-Cooled Products Liquid Cooling Two-Phase CoolingNeed Help With a Thermal Design?
Westech Associates represents Wakefield Thermal Solutions for OEM and engineering customers in Northern California and Nevada.
Whether your application requires a simple heat sink or a complete liquid-cooling solution, our team can help evaluate the thermal requirements and identify an appropriate Wakefield technology.
We can assist with applications involving:
Heat Sinks • Heat Pipes • Vapor Chambers • Liquid Cold Plates • Fans • Thermal Interface Materials • Thermoelectric Cooling • Custom Thermal Solutions
For high-power applications, ask us specifically about Wakefield custom liquid cold plates, friction-stir-welded cold plates, skived-fin heat sinks and heat-pipe/vapor-chamber assemblies.
Contact Westech Associates to discuss your thermal application, request technical information or obtain Wakefield Thermal products for engineering evaluation.
Thermal performance depends on component power, interface resistance, airflow or coolant conditions, ambient temperature, mechanical configuration and other system-level factors. Final thermal solutions should be validated under actual operating conditions.