TIMTEL Thermal Management Materials
TIMTEL, a thermal management brand of Streuter Technologies, manufactures advanced thermal interface materials for electronics cooling applications. Product technologies include phase-change thermal interface materials, thermally conductive silicone films, gap pads, thermal adhesive films, graphite heat spreaders, phase-change compounds and EMI-shielding thermal solutions.
Phase Change Thermal Interface Materials
Phase-change materials soften and flow at operating temperature to wet the mating surfaces, fill microscopic surface irregularities and reduce thermal interface resistance.
Product Families:- M45 Phase Change Film
- XoPhase 45
- UltraPhase 60
- DiaPhase 60
- DiaPhase 60A
- IntraPhase 50 / 60
- ActaPhase 60
- SilverPhase 50
- Low interfacial thermal resistance
- Clean alternative to thermal grease
- Drop-in-place pad format
- Silicone-free constructions
- Dielectric and non-dielectric options
- Custom die-cut formats available
Typical Applications:
IGBT modules, MOSFETs, processors, memory modules, LEDs,
power electronics, automotive electronics and heat-sink assemblies.
M45 Phase Change Film
Free-standing phase-change thermal interface film engineered for high-performance heat transfer between electronic devices and heatsinks or cold plates.
Key Specifications:- Thermal conductivity: 5.0 W/m·K
- Phase-change temperature: 45°C
- 0.15 mm thickness
- 0.20 mm thickness
- 0.30 mm thickness
- Light-tack mounting surface
- Excellent thermal-grease replacement
- Low thermal impedance
- Controlled thixotropic flow
- Silicone-free
- Reworkable after phase change
Typical Applications:
IGBT power modules, CPUs, memory modules, LEDs, automotive
electronics, medical electronics and power-control systems.
XoPhase 45
Soft-flowing phase-change film designed for low-pressure interfaces and very flat mating surfaces.
Key Specifications:- Thermal conductivity: 3.0 W/m·K
- Phase-change temperature: 45°C
- 0.13 mm thickness
- 0.20 mm thickness
- 0.30 mm thickness
- High flow at low pressure
Typical Applications:
Thermoelectric coolers, LED assemblies, CPUs, heat pipes,
microelectronics and ultra-flat thermal interfaces.
Dielectric Phase Change Films
Polyimide-supported phase-change materials provide efficient heat transfer while maintaining electrical isolation between electronic devices and cooling surfaces.
Product Families:- UltraPhase 60
- DiaPhase 60
- DiaPhase 60A Tack Back
- Kapton® MT-supported constructions
- Electrical insulation
- Low thermal interface resistance
- Thin bond-line capability
- Easy handling
- Tack-backed options available
Typical Applications:
Power modules, transistors, power supplies, motor drives and
electrically isolated heatsink assemblies.
Aluminum-Supported Phase Change Materials
Aluminum-foil-supported phase-change materials provide strong mechanical handling and uniform compound thickness for non-isolated thermal interfaces.
Product Families:- IntraPhase 50
- IntraPhase 60
- ActaPhase 60
- SilverPhase 50
Typical Applications:
IGBT modules, power semiconductors, RF components, diodes,
processors and case-sink assemblies.
SILTEL Thermally Conductive Silicone Films
Electrically insulating silicone films combine thermal conductivity, mechanical strength and reliable dielectric performance for power semiconductor cooling.
Product Families:- SP Film — 1.7 W/m·K
- SF-TC1.2
- SF-TC2.0
- SF-TC3.0
- SF-TC4.0
- SF-TC5.0
- SF-TC6.0
- SF-TC8.0 / SF-TC8R
- Up to 8 W/m·K thermal conductivity
- Electrical insulation
- Soft and conformable
- Fiberglass or polyimide reinforcement
- High cut-through resistance
- Tack options available
Typical Applications:
MOSFETs, IGBTs, diodes, converters, motor controls,
power supplies and power electronics.
SILTEL Thermal Gap Pads
Soft gap-filling thermal pads bridge larger mechanical tolerances while maintaining efficient heat transfer from components to heatsinks, chassis or cold plates.
Product Highlights:- Silicone gap pads
- Silicone-free NSG gap pads
- Multiple durometers
- Multiple thermal conductivity levels
- Single- or double-sided tack options
- Sheets or custom die-cut pads
- Fills larger air gaps
- Conforms to component height variation
- Low compression-force options
- Electrically insulating
- Silicone-free options for siloxane-sensitive applications
Typical Applications:
Power modules, memory, automotive electronics, battery systems,
LEDs, industrial controls and communications equipment.
Graphite Heat Spreader Films
Thermally conductive graphite films spread concentrated heat laterally across a larger surface area to reduce hot spots and improve system-level thermal performance.
Product Families:- Graphenol heat spreaders
- Graphenol PCM
- IntraGraph
- IntraGraph PCM
- Graphenol in-plane conductivity up to 1,500 W/m·K
- Thin, flexible graphite construction
- Dry and phase-change-coated options
- Custom die-cut shapes
Typical Applications:
Processors, mobile electronics, LEDs, batteries, power electronics,
displays and compact electronic assemblies.
Thermally Conductive Adhesive Films
Thermally conductive adhesive films provide both heat transfer and mechanical attachment between components and thermal-management hardware.
Product Highlights:- Free-standing thermal adhesive films
- Substrate-supported constructions
- Dielectric options
- Non-dielectric options
- Custom thicknesses
- Pre-formed die-cut pads
Typical Applications:
Heat-sink attachment, LED assemblies, PCB components,
power modules and electronic housings.
Phase Change Compound Bars
Solid phase-change thermal compounds supplied in bar or pen-style formats for manual application directly onto heatsinks or device interface surfaces.
Key Benefits:- Simple manual application
- No dispensing equipment required
- Excellent for repair and rework
- Cleaner than thermal grease
- Controlled application quantity
Typical Applications:
Prototype assembly, field repair, rework, low-volume manufacturing
and service applications.
EMI-Shielding Thermal Pads
Multi-layer thermal pads combine thermal transfer and EMI-shielding functionality for high-frequency electronics.
Featured Product:- EMI-Phase 60
- Multi-layer construction
- Copper or graphite conductive inserts
- Top and bottom insulation layers
- 60°C phase-change temperature
- Custom pad designs available
Typical Applications:
RF power devices, high-frequency transistors, communications
electronics, power amplifiers and EMI-sensitive assemblies.
Custom Die-Cut Thermal Materials
TIMTEL materials can be supplied as finished thermal pads rather than only bulk sheet material, simplifying installation and production.
Available Formats:- Individual die-cut pads
- Multiple pads per sheet
- Die-cut reels
- Rolls and sheets
- Custom liner systems
- Prototype and production quantities
Typical Applications:
OEM electronics programs requiring application-specific pad
geometry, thickness and installation features.
Featured TIMTEL Technologies
M45 Phase Change Film
A 5 W/m·K, 45°C phase-change film that provides a clean, pre-formed alternative to thermal grease.
Best For: IGBT modules, CPUs, power electronics and heatsink or cold-plate interfaces.
SILTEL Gap Pads
Soft, compliant thermal gap fillers bridge mechanical tolerances between components and cooling hardware.
Best For: Larger gaps, component-height variations and electrically insulating thermal interfaces.
SILTEL Thermal Films
Reinforced silicone films provide electrical insulation together with thermal conductivity and mechanical durability.
Best For: MOSFET, IGBT, diode and power-module mounting applications.
Graphenol Heat Spreaders
High in-plane graphite conductivity spreads localized heat away from hot spots and over a larger cooling area.
Best For: Thin electronics, processors, batteries, LEDs and high-power assemblies.
EMI-Phase 60
Multi-layer construction combines phase-change thermal transfer with EMI suppression.
Best For: High-frequency transistor and RF electronics where both thermal and EMI performance are required.
Custom Pre-Formed Pads
In-house converting allows TIMTEL thermal materials to be supplied in production-ready shapes and liner configurations.
Best For: OEM production programs requiring repeatable installation and reduced assembly labor.
Which TIMTEL Thermal Technology Is Right for Your Application?
Start with Phase Change Materials .
Consider M45 Phase Change Film .
Consider SILTEL Thermal Films .
Choose SILTEL Thermal Gap Pads.
Consider Graphenol or IntraGraph Heat Spreaders.
Consider Thermally Conductive Adhesive Films.
Consider EMI-Phase 60.
TIMTEL offers custom die-cut and pre-formed thermal pads.